Non-volatile two-transistor programmable logic cell and array layout

ABSTRACT

A two-transistor non-volatile memory cell is formed in a semiconductor body. A memory-transistor well is disposed within the semiconductor body. A switch-transistor well is disposed within the semiconductor body and is electrically isolated from the memory transistor well. A memory transistor including spaced-apart source and drain regions is formed within the memory-transistor well. A switch transistor including spaced-apart source and drain regions is formed within the switch-transistor well region. A floating gate is insulated from and self aligned with the source and drain regions of the memory transistor and switch transistor. A control gate is disposed above and aligned to the floating gate and with the source and drain regions of the memory transistor and the switch transistor.

RELATED APPLICATIONS

The present application is a continuation-in-part of application Ser.No. 11/155,005, filed Jun. 15, 2005 now U.S. Pat. No. 7,285,818.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to programmable integrated circuits. Morespecifically, the present invention relates to layouts for non-volatilememory cells and arrays.

2. The Prior Art

Two-transistor non-volatile memory cells for use in programmableintegrated circuits are known in the art. FIGS. 1A and 1B are,respectively, top and cross sectional views of an illustrative group ofthree pairs of two-transistor non-volatile memory cells. The crosssectional view of FIG. 1B is taken through the dashed line 1B-1B in FIG.1A.

Each two-transistor non-volatile memory cell (one of which is shown indashed rectangle 10) of FIG. 1A and is shown formed inside of a p-typewell shown at reference numeral 12 formed within an n-type well 14. Eachtwo-transistor non-volatile memory includes a memory transistor and aswitch or pass transistor controlled by the memory transistor, disposedwithin the p-type well. The memory transistor is used to program anderase the cell. The switch transistor may be used, for example, to makeinterconnections in an FPGA or other programmable logic device. As shownin FIGS. 1A and 1B, the memory transistors are formed from portions ofactive source/drain regions 16-1, 16-2, and 16-3. These activesource/drain regions are shown in solid lines at the right side of eachtwo-transistor non-volatile memory cell in the top view of FIG. 1A andin dashed lines in FIG. 1B as they are out of the plane of the crosssection which bisects the channel of the top row of transistors as canbe seen by the dashed line 1B-1B in FIG. 1A. Similarly, the switchtransistors are formed by portions of active regions 18-1, 18-2, and18-3, shown in solid lines at the left side of each two-transistornon-volatile memory cell in FIG. 1A and in dashed lines in FIG. 1B.

Persons of ordinary skill in the art will observe that mirrored pairs ofmemory transistors and switch transistors are shown in p-type well 12 inFIGS. 1A and 1B. Contacts 20-1, 20-2, and 20-3 each form a common sourceconnection for a pair of memory transistors and contacts 22-1, 22-2, and22-3 each form a common source connection for a pair of switchtransistors. Contacts 24-1, 24-2, and 24-3 each connect to the drain ofone of the memory transistors in each pair of cells sharing commonsource connections shown in FIG. 1A. Contacts 26-1, 26-2, and 26-3 eachconnect to a drain of one of the memory transistors in each pair ofcells sharing common source connections shown in FIG. 1A. Contacts 28-1,28-2, and 28-3 each connect to a drain of one of the switch transistorsin each pair of cells and contacts 30-1, 30-2, and 30-3 each connect toa drain of a switch transistor in each pair of cells.

Common control gate 32 is associated with the upper memory and switchtransistors of all the pairs of two-transistor non-volatile memory cellsshown in FIG. 1A and common control gate 34 is associated with the lowermemory and switch transistors of all the pairs of two-transistornon-volatile memory cells. Shown in FIG. 1B, floating gate segments36-1, 36-2, and 36-3, respectively, are common to the upper memory andswitch transistors in each of the three cell pairs shown Floating gatesegments 36-1, 36-2, and 36-3 (hidden under control gate 32 andtherefore not shown in FIG. 1A) are common to the second memory andswitch transistors in the three cell pairs shown in FIGS. 1A and 1B. Aswill be appreciated by persons of ordinary skill in the art, thefloating gate segments are aligned with the control gates with whichthey are associated.

The programming, erasing, and normal-mode operating of thetwo-transistor, non-volatile memory cells shown in FIGS. 1A and 1B areall well known to persons of ordinary skill in the art. Briefly, thetwo-transistor non-volatile memory cell is programmed using the memorytransistor. Because the memory transistor and the switch transistorshare the same floating gate, the switch transistor is either turned offor turned on depending on the programmed or erased state of the memorytransistor.

As can be seen from an examination of FIGS. 1A and 1B the memorytransistors are smaller than the switch transistors. As will beappreciated by persons of ordinary skill in the art, this makes thememory transistors easier to program and also allows the switchtransistors to have a low on resistance.

While the two-transistor memory cells shown in FIGS. 1A and 1B functionsatisfactorily for their intended purpose, there remains room forimprovement in the technology.

BRIEF DESCRIPTION OF THE INVENTION

A non-volatile memory cell is formed in a semiconductor body. Amemory-transistor well is disposed within the semiconductor body. Aswitch-transistor well is disposed within the semiconductor body and iselectrically isolated from the memory-transistor well. A memorytransistor through which the cell may be programmed and erased is formedwithin the memory-transistor well and includes spaced-apart source anddrain regions. A switch transistor that may be used to makeinterconnections between circuit elements is formed within theswitch-transistor well region and includes spaced-apart source and drainregions. A floating gate is insulated from and self aligned with thesource and drain regions of the memory transistor and the switchtransistor. A control gate is disposed above and self aligned withrespect to the floating gate and with the source and drain regions ofthe memory transistor and the switch transistor.

An array of non-volatile memory cells is formed in a semiconductor body.A memory-transistor well is disposed within the semiconductor body. Aswitch-transistor well is disposed within the semiconductor body and iselectrically isolated from the memory-transistor well. A plurality ofmemory transistors are formed within the memory transistor well, eachincluding spaced-apart source and drain regions. A plurality of switchtransistors are formed within the switch-transistor well region, eachassociated with one of the memory transistors and including spaced-apartsource and drain regions. Each memory transistor includes a floatinggate insulated from and self-aligned with the source and drain regionsof the switch transistor with which it is associated. Each memorytransistor also includes a control gate disposed above and self alignedwith its floating gate and with the source and drain regions of the atleast one switch transistor with which it is associated. More than oneswitch transistor may be associated with a memory transistor.

According to another aspect of the present invention, because the memorytransistors and the switch transistor are disposed in different wells,the characteristics of the memory-transistor wells and transistors, andthe characteristics of the switch-transistor wells and transistors canbe separately optimized for the different performance characteristicsdesired for each of these devices.

BRIEF DESCRIPTION OF THE DRAWING FIGURES

FIGS. 1A and 1B are, respectively, top and cross-sectional views of alayout of a group of prior-art two-transistor non-volatile memory cells.

FIGS. 2A and 2B are, respectively, top and cross-sectional views of alayout of a group of two-transistor non-volatile memory cells accordingto one aspect of the present invention employing common high-voltagen-type well isolation.

FIGS. 3A and 3B are, respectively, top and cross-sectional views of alayout of a group of two-transistor non-volatile memory cells accordingto another aspect of the present invention employing common n-type wellisolation and n-type well isolation.

FIGS. 4A and 4B are, respectively, top and cross-sectional views of alayout of a group of two-transistor non-volatile memory cells accordingto another aspect of the present invention employing common n-type wellisolation and n-type well isolation with underlying deep n-type wellisolation.

FIGS. 5A and 5B are, respectively, top and cross-sectional views of alayout of a group of two-transistor non-volatile memory cells accordingto another aspect of the present invention employing common n-type wellisolation and n-type well isolation with underlying deep n-type wellisolation as well as enhanced p-type well isolation.

FIGS. 6A and 6B are, respectively, top and cross-sectional views of alayout of a group of two-transistor memory cells according to anotheraspect of the present invention employing deep-trench isolation.

FIGS. 7A and 7B are, respectively, top and cross-sectional views of alayout of a group of memory cells according to another aspect of thepresent invention wherein a single memory transistor controls two switchtransistors.

FIGS. 8A through 8E are cross-sectional views of a layout of a group ofmemory cells such as those in FIGS. 7A and 7B, showing various isolationmethods according to the present invention.

FIGS. 9A and 9B are, respectively, top and cross-sectional views of alayout of a group of memory cells according to another aspect of thepresent invention wherein a single memory transistor controls fourswitch transistors.

DETAILED DESCRIPTION OF THE INVENTION

Persons of ordinary skill in the art will realize that the followingdescription of the present invention is illustrative only and not in anyway limiting. Other embodiments of the invention will readily suggestthemselves to such skilled persons. For example, although exemplaryembodiments of the invention are disclosed employing n-channeltransistors disposed in p-type bulk regions, p-type transistors disposedin n-type bulk regions may also be employed. In addition, well isolationtechniques are disclosed herein, but persons of ordinary skill in theart will appreciate that other isolation techniques, such as silicon oninsulator (SOI), may be employed to form the two-transistor non-volatilememory cells and arrays of the present invention.

Referring now to FIGS. 2A and 2B, top and cross-sectional views,respectively, are shown of a layout of a group of two-transistornon-volatile memory cells according to one aspect of the presentinvention employing common high-voltage n-type well isolation. The crosssection of FIG. 2B is taken through the dashed line 2B-2B of FIG. 2A.

Unlike the two-transistor non-volatile memory cells of FIGS. 1A and 1B,the transistors of non-volatile memory cells of the present inventionare distributed among different p-type wells. Memory transistors andswitch transistors are disposed in separate p-wells. As in FIGS. 1A and1B, the memory cell p-type wells are shown disposed in n-type region 40.N-type region 40 is typically an n-type well disposed in a semiconductorsubstrate (not shown), although persons of ordinary skill in the artwill appreciate that region 40 could be another structure, such as ann-type epitaxial layer formed over a semiconductor substrate as is knownin the art. N-type wells may have a depth of between about 0.5 to about5 microns and doping concentrations between about 1e16 and about 1e18.

A memory-transistor p-type well 42 is disposed in the n-type well 40.P-type well 42 may have a depth between about 0.5 to about 5 microns andmay typically be about 30% deeper than the switch p-type wells. P-typewells 42 may be doped to concentrations from between about 1e16 andabout 6e17. Active n-type regions 44 and 46 are formed inmemory-transistor p-type well 42 and may have doping concentrationsbetween about 1e18 and about 1e19. As will be appreciated by persons ofordinary skill in the art, a mirrored memory-transistor structure isdepicted in FIG. 2A, wherein a contact 48 makes contact to a portion ofactive region 44 that acts as the common source for two separate memorytransistors. Contact 50 makes contact to the drain region of a first(upper) one of the memory transistors and contact 52 makes contact tothe drain region of a second (lower) one of the memory transistors.Similarly, contact 54 makes contact to a portion of active region 46that acts as the common source for two separate memory transistors,contact 56 makes contact to a drain region of a first (upper) one of thememory transistors in active region 46 and contact 58 makes contact tothe drain region of a second (lower) one of the memory transistors inactive region 46. Thus, four separate transistors are shown disposedwithin memory-transistor p-type well 42.

A first switch-transistor p-type well 60 is disposed in n-type well 40and is spaced apart from memory-transistor p-type well 42. As withmemory-transistor p-type well 42, mirrored switch transistors may beemployed in the present invention. Thus, n-type active regions 62 and 64are formed in switch-transistor p-type well 60. A contact 66 makescontact to a portion of active region 62 that acts the common source fortwo separate switch transistors. Contact 68 makes contact to the drainregion of a first (upper) one of the switch transistors in active region62 and contact 70 makes contact to the drain region of a second (lower)one of the switch transistors in active region 62. Similarly, contact 72makes contact to a portion of active region 64 that acts the commonsource for two separate switch transistors. Contact 74 makes contact tothe drain region of a first (upper) one of the memory transistors inactive region 64 and contact 76 makes contact to the drain region of asecond (lower) one of the memory transistors in active region 64. Thus,four separate transistors are shown disposed within switch-transistorp-type well 60.

A second switch-transistor p-type well 80 is disposed in n-type well 40and is spaced apart from memory-transistor p-type well 42 on the sideopposite from first switch-transistor p-type well 60. As withswitch-transistor p-type well 60, mirrored switch transistors may beemployed in second switch-transistor p-type well 80. Thus, n-type activeregions 82 and 84 are formed in switch-transistor p-type well 80. Acontact 86 makes contact to a portion of active region 82 that acts asthe common source for two separate switch transistors. Contact 88 makescontact to the drain region of a first (upper) one of the switchtransistors in active region 82 and contact 90 makes contact to thedrain region of a second (lower) one of the switch transistors in activeregion 82. Similarly, contact 92 makes contact to a portion of activeregion 84 that acts as the common source for two separate switchtransistors. Contact 94 makes contact to the drain region of a first(upper) one of the memory transistors in active region 84 and contact 96makes contact to the drain region of a second (lower) one of the memorytransistors in active region 84. Thus, four separate transistors areshown disposed within switch-transistor p-type well 80.

Floating gate segment 98 (seen in FIG. 2B) is common to the upper memorytransistor formed in active region 44 of memory-transistor p-type well42 and the upper switch transistor formed in active region 62 of firstswitch-transistor p-type well 60. A similar floating gate (out of theplane of the cross section of FIG. 2B) is common to the lower memorytransistor formed in active region 44 of memory-transistor p-type well42 and the lower switch transistor formed in active region 62 of firstswitch-transistor p-type well 60. As will be appreciated by persons ofordinary skill in the art from the description so far, the two switchtransistors formed in active region 64 of switch-transistor p-type well60 are associated with a pair of memory transistors located off of theleft-hand side of FIGS. 2A and 2B and thus not shown in the figures. Aportion of a floating gate segment 100 is shown that would be used tocouple to the upper memory transistor located off of the left-hand sideof FIGS. 2A and 2B.

Floating gate segment 102 (seen in FIG. 2B) is common to the uppermemory transistor formed in active region 46 of memory-transistor p-typewell 42 and the upper switch transistor formed in active region 82 ofsecond switch-transistor p-type well 80. A similar floating gate (out ofthe plane of the cross section of FIG. 2B) is common to the lower memorytransistor formed in active region 46 of memory-transistor p-type well42 and the lower switch transistor formed in active region 82 of secondswitch-transistor p-type well 80. As will also be appreciated by personsof ordinary skill in the art from the description so far, the two switchtransistors formed in active region 84 of switch-transistor p-type well80 are associated with a pair of memory transistors located off of theright-hand side of FIGS. 2A and 2B and thus not shown in the figures. Aportion of a floating gate segment 104 is shown that would be used tocouple to the upper memory transistor located off of the right-hand sideof FIGS. 2A and 2B.

It is apparent that the group of memory cells depicted in FIGS. 2A and2B may preferably be conveniently configured to be symmetrical about avertical axis centered between active regions 44 and 46 inmemory-transistor p-type well 42 and also about a horizontal axisrunning through contacts 48, 54, 62, 72, 86, and 92 in memory-transistorp-type well 42 and first and second switch transistor p-type wells 60and 80. This feature of the present invention facilitates layout oflarge arrays of two-transistor memory cells for applications such aslarge-gate-count programmable integrated circuits.

As may be seen from an examination of FIGS. 2A and 2B, control gate 106is disposed above and aligned with floating gate segments 98, 100, 102,and 104. Control gate 106 is common to all of the upper memorytransistors and upper switch transistors in the group depicted in FIGS.2A and 2B, as well as to memory and switch transistors in other groupsdisposed within the same horizontal plane as the upper transistors shownin FIGS. 2A and 2B. Similarly, control gate 108 is disposed above andaligned with floating gate segments (not shown) associated with thelower memory and switch transistors in the group that are out of theplane of the cross section of FIG. 2B. Control gate 108 is common to allof the lower memory transistors and lower switch transistors in thegroup depicted in FIGS. 2A and 2B, as well as to lower memory and switchtransistors in other groups disposed within the same horizontal plane asthe lower transistors shown in FIGS. 2A and 2B.

As will be appreciated by persons of ordinary skill in the art, thelayout of the present invention permits the use of single straightsegmented polysilicon lines to form all of the floating gates for theupper (and lower) memory and switch transistors of the group oftwo-transistor non-volatile memory cells depicted in FIGS. 2A and 2B.

Such skilled persons will observe that the n-type well 40 acts toadvantageously provide electrical isolation of the memory transistor ineach two-transistor non-volatile memory cell from its switch transistor.This isolation, combined with the grouping of the memory transistors ina memory-transistor well and the switch transistors in aswitch-transistor well, not only allows for advantageously programmingand erasing of the memory cells, but also advantageously allows thewells, the memory transistors, and the switch transistors to beseparately optimized for desired characteristics. For example, thememory-well depth, doping and diffusion parameters and switch-welldepth, doping and diffusion parameters can be separately optimized fordesired characteristics of the memory transistors (e.g., ease ofprogramming and erase and efficiency) and the switch transistors (e.g.,speed, current handling capability). Furthermore, the layout of thepresent invention will allow a single memory transistor to controlmultiple switch transistors. For example, in an embodiment where switchp-well 80 contains four active regions, a single memory transistor inactive region 46 shares a floating gate with, and therefore controls,two transistors in the switch p-well closest to the memory transistor,while the switch transistors closest to the next memory transistorp-well (located on the opposite side of the switch p-well) will becontrolled by that memory transistor.

Referring now to FIGS. 3A and 3B, top and cross-sectional views,respectively, are shown of a layout of a group of two-transistornon-volatile memory cells according to another aspect of the presentinvention employing common n-type well isolation and other n-type wellisolation. The cross section of FIG. 3B is taken through the dashed line3B-3B of FIG. 3A.

The layout of the group of two-transistor non-volatile memory cellsshown in FIGS. 3A and 3B is similar to that depicted in FIGS. 2A and 2B.Elements of the layout of FIGS. 3A and 3B that correspond to elements ofthe layout depicted in FIGS. 2A and 2B are designated in FIGS. 3A and 3Busing the same reference numerals as their counterparts in FIGS. 2A and2B.

In addition to the isolation provided by the n-type well 40, furtherisolation is provided by the presence of higher-doped n-type well 110.As shown most clearly in FIG. 3A, higher-doped n-type well 110 surroundseach of the memory-transistor p-type wells 42, and the switch-transistorp-type well regions 60 and 80. As shown in FIGS. 3A and 3B, the outeredges of higher-doped n-type well 110 are preferably spaced apart fromthe edges of the memory-transistor p-type well region 42 and theswitch-transistor p-type well regions 60 and 80. The n-type well regions110 are referred to as higher-doped n-type wells because they are dopedat a concentration higher than that of the surrounding n-type well 40.For example, the higher-doped n-wells may be doped at a concentrationthat is about an order of magnitude higher than that of the n-type wellregions 40.

Referring now to FIGS. 4A and 4B, top and cross-sectional views,respectively, are shown of a layout of a group of two-transistornon-volatile memory cells according to another aspect of the presentinvention employing common n-type well isolation and other n-type wellisolation with underlying deep n-type well isolation. The cross sectionof FIG. 4B is taken through the dashed line 4B-4B of FIG. 4A.

The layout of the group of two-transistor non-volatile memory cellsshown in FIGS. 4A and 4B is similar to that depicted in FIGS. 3A and 3B.Elements of the layout of FIGS. 4A and 4B that correspond to elements ofthe layout depicted in FIGS. 3A and 3B are designated in FIGS. 4A and 4Busing the same reference numerals as their counterparts in FIGS. 3A and3B.

From an examination of FIG. 4B, it may be seen that a deep n-type wellregion 112 is formed under higher-doped n-type well region 110. Deepn-type well region 122 may be formed to a depth of between about 0.3microns and about 3 microns deeper than the p-wells containing thetransistors.

Referring now to FIGS. 5A and 5B, top and cross-sectional views,respectively, are shown of a layout of a group of two-transistornon-volatile memory cells according to another aspect of the presentinvention employing common n-type well isolation and other n-type wellisolation with underlying deep n-type well isolation as well as enhancedp-type well isolation. The cross section of FIG. 5B is taken through thedashed line 5B-5B of FIG. 5A.

The layout of the group of two-transistor non-volatile memory cellsshown in FIGS. 5A and 5B is similar to that depicted in FIGS. 4A and 4B.Elements of the layout of FIGS. 5A and 5B that correspond to elements ofthe layout depicted in FIGS. 4A and 4B are designated in FIGS. 5A and 5Busing the same reference numerals as their counterparts in FIGS. 4A and4B.

In addition to the n-type well regions 110 and the deep n-type wellregions 112, enhanced p-type regions 114 are disposed about theperiphery of the memory-transistor p-type well 42 and theswitch-transistor p-type wells 60 and 80. Persons of ordinary skill inthe art will also note that, instead of being spaced apart from theedges of the memory-transistor p-type well 42 and the switch-transistorp-type wells 60 and 80, the higher-doped n-type wells 110 and deepn-type wells 112 are preferably located at the edges of thememory-transistor p-type well 42 and the switch-transistor p-type wells60 and 80 as shown most clearly in FIG. 5B. The enhanced p-type regions114 are areas of higher p-type dopant concentration. Persons of ordinaryskill in the art will appreciate that, by adding the enhanced p-typeregions and placing the deep n-type well regions 112 adjacent to thedevices, the space-charge regions are significantly reduced. Since thespace-charge regions are simply lost area, this geometry allows closerspacing of the devices and thus permits a more closely-spaced layout

In the groups of two-transistor non-volatile memory cells presentlydisclosed, the higher-doped n-type well regions 110 are the most heavilydoped. The deep n-type well regions 112 are doped to about 25% of theconcentration of the higher-doped n-type well regions 110. The n-typewell regions 40 are doped to a concentration that is about an order ofmagnitude lower than that of the higher-doped n-type well regions 110.The enhanced p-type well regions are doped to a higher than the otherp-type well regions to reduce depletion regions.

Referring now to FIGS. 6A and 6B, top and cross-sectional views,respectively, are shown of a layout of a group of two-transistornon-volatile memory cells according to another aspect of the presentinvention employing deep-trench isolation. The cross section of FIG. 6Bis taken through the dashed line 6B-6B of FIG. 6A.

As may be easily seen in both FIGS. 6A and 6B, deep-trench isolationregions 116 are disposed around each of the memory-transistor p-typewell 42 and the switch-transistor p-type wells 60 and 80. As will beappreciated by persons of ordinary skill in the art, and as shown mostclearly in FIG. 6B, deep-trench isolation regions 116 extend verticallydown into n-type well region 42. Deep-trench isolation regions 116 areformed using known technology, and may be filled with silicon oxide orpolysilicon, as is known in the art.

In all of the embodiments of the present invention, thememory-transistor p-type well 42 is decoupled from the switch-transistorp-type wells 60 and 80. This allows optimization of thememory-transistor p-type well 42 for program and erase efficiency andoptimization of the switch-transistor p-type wells 60 and 80 for deviceperformance. Accordingly, the switch-transistor p-type wells 50 and 80may be formed as regular low-voltage or I/O device p-type wells. Inaddition, the switch-transistor source/drain implants, channel lengthsand well implants may be optimized for performance characteristics suchas low output impedance, and to suppress hot carrier injectionprogramming.

Similarly, the memory-transistor source/drain implants, halo implants,well implants and channel lengths can be optimized for hot carrierinjection or Fowler-Nordheim program and erase efficiency and devicereliability. Depending on the junction breakdown levels, the switchtransistors and the memory transistors can both be placed in low-voltagewells, or the switch transistors can be placed in a low-voltage well andthe memory transistors can be placed in a high-voltage well to optimizethe spacing between the wells to favorably impact memory cell size.

Referring now to FIGS. 7A and 7B, top and cross-sectional views,respectively, are shown of a layout of a group of non-volatile memorycells according to one aspect of the present invention in which a singlememory transistor controls two switch transistors. The cross section ofFIG. 7B is taken through the dashed line 7B-7B of FIG. 7A.

As in the two-transistor non-volatile memory cells of FIGS. 2A and 2Bthrough 6A and 6B, the non-volatile memory cells of FIGS. 7A and 7B aredistributed among different p-type wells for memory transistors and forswitch transistors. As in the other embodiments of the present inventiondisclosed herein, the memory cell p-type wells are shown disposed inn-type regions 40.

N-type regions 40 are typically an n-type well disposed in asemiconductor substrate (not shown), although persons of ordinary skillin the art will appreciate that region 40 could be another structure,such as an n-type epitaxial layer formed over a semiconductor substrateas is known in the art. N-type wells may have a depth between about 0.5to about 5 microns and doping concentrations between about 1e16 andabout 1e18.

In the embodiment depicted in FIGS. 7A and 7B, three memory-transistorp-type wells 42 are disposed in the n-type well 40. Thememory-transistor P-type wells 42 may have depths between about 0.5 toabout 5 microns and may typically be about 30% deeper than the switchp-type wells 40. The memory-transistor P-type wells 42 may be doped to alevel between about 1e16 and about 6e17. An active n-type region 44 isformed in each of memory-transistor p-type wells 42 and may have dopingconcentrations ranging from between about 1e18 and about 1e19. As willbe appreciated by persons of ordinary skill in the art, a mirroredmemory-transistor structure is depicted in FIG. 7A, wherein, in each ofp-type wells 42, a contact 48 makes contact to a portion of activeregion 44 that acts as the common source for two separate memorytransistors. Contact 50 makes contact to the drain region of a first(upper) one of the memory transistors and contact 52 makes contact tothe drain region of a second (lower) one of the memory transistors.Thus, two separate transistors are shown disposed within eachmemory-transistor p-type well 42.

A first switch-transistor p-type well 60 is disposed in n-type well 40to the left of the center one of memory-transistor p-type wells 42 andis spaced apart therefrom. As with memory-transistor p-type wells 42,mirrored switch transistors may be employed in the present invention.Thus, n-type active regions 62 and 64 are formed in switch-transistorp-type well 60. A contact 66 makes contact to a portion of active region62 that acts the common source for two separate switch transistors.Contact 68 makes contact to the drain region of a first (upper) one ofthe switch transistors in active region 62 and contact 70 makes contactto the drain region of a second (lower) one of the switch transistors inactive region 62. Similarly, contact 72 makes contact to a portion ofactive region 64 that acts the common source for two separate switchtransistors. Contact 74 makes contact to the drain region of a first(upper) one of the memory transistors in active region 64 and contact 76makes contact to the drain region of a second (lower) one of the memorytransistors in active region 64. Thus, four separate transistors areshown disposed within switch-transistor p-type well 60.

A second switch-transistor p-type well 80 is disposed in n-type well 40to the right of the center one of memory-transistor p-type wells 42 andis spaced apart therefrom. As with switch-transistor p-type well 60,mirrored switch transistors may be employed in second switch-transistorp-type well 80. Thus, active regions 82 and 84 are formed inswitch-transistor p-type well 80. A contact 86 makes contact to aportion of active region 82 that acts as the common source for twoseparate switch transistors. Contact 88 makes contact to the drainregion of a first (upper) one of the switch transistors in active region82 and contact 90 makes contact to the drain region of a second (lower)one of the switch transistors in active region 82. Similarly, contact 92makes contact to a portion of active region 84 that acts as the commonsource for two separate switch transistors. Contact 94 makes contact tothe drain region of a first (upper) one of the memory transistors inactive region 84 and contact 96 makes contact to the drain region of asecond (lower) one of the memory transistors in active region 84. Thus,four separate transistors are also shown disposed withinswitch-transistor p-type well 80.

Similarly, the leftmost one of memory-transistor p-type wells 42 isspaced apart from the first switch-transistor p-type well 60, andcontains active region 118, common source contact 120, and upper andlower drain contact regions 122 and 124, respectively. In like manner,the rightmost one of memory-transistor p-type wells 42 is spaced apartfrom the second switch-transistor p-type well 60, and contains activeregion 126, common source contact 128, and upper and lower drain contactregions 130 and 132, respectively.

Only the rightmost portion of a third switch-transistor p-type well 134is shown disposed to the left of and spaced apart from the leftmost oneof memory-transistor p-type wells 42, having an active region 136 formedtherein. A contact 138 makes contact to a portion of active region 136that acts as the common source for two separate switch transistors.Contact 140 makes contact to the drain region of a first (upper) one ofthe switch transistors in active region 136 and contact 142 makescontact to the drain region of a second (lower) one of the transistorsin active region 136.

In addition, only the leftmost portion of a fourth switch-transistorp-type well 144 is disposed to the right of and spaced apart from therightmost one of memory-transistor p-type wells 42 and having activeregion 146 formed therein. Contact 148 makes contact to a portion ofactive region 146 that acts as the common source for two separate switchtransistors. Contact 150 makes contact to the drain region of a first(upper) one of the memory transistors in active region 146 and contact152 makes contact to the drain region of a second (lower) one of thememory transistors in active region 146.

Floating gate segment 154 (seen in FIG. 7B) is common to the uppermemory transistor formed in active region 44 of the center one ofmemory-transistor p-type wells 42, the upper switch transistor formed inactive region 64 of first switch-transistor p-type well 60, and theupper switch transistor formed in active region 82 of secondswitch-transistor p-type well 80. A similar floating gate (out of theplane of the cross section of FIG. 7B) is common to the lower memorytransistor formed in active region 44 of the center one ofmemory-transistor p-type wells 42, the lower switch transistor formed inactive region 62 of first switch-transistor p-type well 60, and thelower switch transistor formed in active region 82 of secondswitch-transistor p-type well 80.

Floating gate segment 156 (seen at the left side of FIG. 7B) is commonto the upper memory transistor formed in active region 46 of theleftmost memory-transistor p-type well 42, the upper switch transistorformed in active region 62 of first switch-transistor p-type well 60,and the upper switch transistor formed in active region 136 of thirdswitch-transistor p-type well 134. A similar floating gate (out of theplane of the cross section of FIG. 7B) is common to the lower memorytransistor formed in active region 46 of the leftmost memory-transistorp-type well 42, and the lower switch transistor formed in active region136 of third switch-transistor p-type well 134.

Similarly, floating gate segment 158 (seen at the right side of FIG. 7B)is common to the upper memory transistor formed in active region 46 ofthe rightmost memory-transistor p-type well 42, the upper switchtransistor formed in active region 84 of second switch-transistor p-typewell 60, and the upper switch transistor formed in active region 146 offourth switch-transistor p-type well 144. A similar floating gate (outof the plane of the cross section of FIG. 7B) is common to the lowermemory transistor formed in active region 46 of the rightmostmemory-transistor p-type well 42, and the lower switch transistor formedin active region 146 of third switch-transistor p-type well 144.

As will also be appreciated by persons of ordinary skill in the art fromthe description so far, the other switch transistors formed inswitch-transistor p-type wells 134 and 144 are associated with memorytransistors that are respectively located off of the left-hand andright-hand side of FIGS. 7A and 7B and that are thus not shown in thefigures. Such skilled persons will also appreciate that the p-typeswitch transistor wells located at the left and right edges of the arraymay each have only a single active area for switch transistors formedtherein.

It is apparent that the group of memory cells depicted in FIGS. 7A and7B may preferably be conveniently configured to be symmetrical about avertical axis centered in the active region in the center one ofmemory-transistor p-type wells 42 and also about a horizontal axisrunning through the source contacts 48, 66, 72, 86, 92, 120, 128, 138,and 148 in memory-transistor p-type wells 42 and first through fourthswitch transistor p-type wells 60, 80, 134, and 144. This feature of thepresent invention facilitates layout of large arrays of memory cells forapplications such as large-gate-count programmable integrated circuits.

As may be seen from an examination of FIGS. 7A and 7B, control gate 160is disposed above and aligned with floating gate segments 154, 156, and158. Control gate 160 is common to all of the upper memory transistorsand upper switch transistors in the group depicted in FIGS. 7A and 7B,as well as to memory and switch transistors in other groups disposedwithin the same horizontal plane as the upper transistors shown in FIGS.7A and 7B. Similarly, control gate 162 is disposed above and alignedwith floating gate segments associated with the lower memory and switchtransistors in the group that are out of the plane of the cross sectionof FIG. 7B. Control gate 162 is common to all of the lower memorytransistors and lower switch transistors in the group depicted in FIGS.7A and 7B, as well as to lower memory and switch transistors in othergroups disposed within the same horizontal plane as the lowertransistors shown in FIGS. 7A and 7B.

As will be appreciated by persons of ordinary skill in the art, thelayout of the present invention permits the use of single straightsegmented polysilicon lines to form all of the floating gates for theupper (and lower) memory and switch transistors of the group ofnon-volatile memory cells depicted in FIGS. 7A and 7B.

Such skilled persons will observe that the various isolation techniquesshown in FIGS. 2A and 2 b through 6A and 6B may be employed in thenon-volatile memory cell array layout shown in FIGS. 7A and 7B. Thisfeature of the embodiment of FIGS. 7A and 7B is shown in FIGS. 8Athrough 8E, which are cross sections of such memory cells illustratingthe various isolation techniques. As may be seen from an examination ofFIGS. 8A through 8E, each cross sectional view is taken of a portion ofthe array of memory cells in FIGS. 7A and 7B extending through theswitch p-type wells 60 and 80. From what is shown in FIGS. 8A through8E, persons of ordinary skill in the art will appreciate how theisolation techniques illustrated therein extend to the remainder of thestructures in FIGS. 7A and 7B.

Referring now to FIG. 8A, it may be seen that n-type well 40 acts toadvantageously provide electrical isolation of the memory transistor ineach non-volatile memory cell from its switch transistor. Thisisolation, shown at reference numerals 164, combined with the groupingof the memory transistors in a memory-transistor well and the switchtransistor in a switch-transistor well, not only allows foradvantageously programming and erasing of the memory cells, but alsoadvantageously allows the wells, the memory transistors, and the switchtransistors to be separately optimized for desired characteristics. Forexample, the memory-well depth, doping and diffusion parameters andswitch-well depth, doping and diffusion parameters can be separatelyoptimized for desired characteristics of the memory transistors (e.g.,programming and erase method and efficiency) and the switch transistors(e.g., speed, current handling capability).

Referring now to FIG. 8B, a layout of a group of non-volatile memorycells according to another aspect of the present invention is shownemploying common n-type well isolation and other n-type well isolation.In addition to the isolation provided by the n-type well 40, furtherisolation is provided by the presence of higher-doped n-type well 166.As shown in FIG. 8B, higher-doped n-type wells 166 disposed in isolationregions 164 surround each of the memory-transistor p-type wells 42 andthe switch-transistor p-type well regions 60 and 80. As shown in FIG.8B, the outer edges of higher-doped n-type well 166 are preferablyspaced apart from the edges of the memory-transistor p-type well regions42 and the switch-transistor p-type well regions 60 and 80. The dopingconcentration of higher-doped n-type well 166 is higher, and may be, forexample, about two times the concentration of the n-well in which it isformed.

Referring now to FIG. 8C, a cross-sectional view shows a layout of agroup of non-volatile memory cells according to another aspect of thepresent invention employing common n-type well isolation and othern-type well isolation with underlying deep n-type well isolation. Thelayout of the group of non-volatile memory cells shown in FIG. 8C issimilar to that depicted in FIG. 8B. From an examination of FIG. 8B, itmay be seen that a deep n-type well region 168 is formed under eachn-type well region 166. Deep n-type well region 168 may be formed to adepth sufficient to prevent leakage between adjacent p-wells.

Referring now to FIG. 8D, a cross-sectional view shows a layout of agroup of non-volatile memory cells according to another aspect of thepresent invention employing common n-type well isolation and othern-type well isolation with underlying deep n-type well isolation as wellas enhanced p-type well isolation. In addition to the n-type wellregions 80 and the deep n-type well regions 168, enhanced p-type regions170 are disposed about the periphery of the memory-transistor p-typewell 42 and the switch-transistor p-type wells 60 and 80. Persons ofordinary skill in the art will also note that, instead of being spacedapart from the edges of the memory-transistor p-type well 42 and theswitch-transistor p-type wells 60 and 80, the n-type wells 166 and deepn-type wells 168 are preferably located at the edges of thememory-transistor p-type well 42 and the switch-transistor p-type wells60 and 80 as shown 6 in FIG. 8C. The enhanced p-type regions 170 areareas of higher p-type dopant concentration than the p-wells that theysurround in order to suppress the widths of the space charge regionsbetween the p-well and the adjacent isolation n-well. Persons ofordinary skill in the art will appreciate that, by adding the enhancedp-type regions and placing the deep n-type well regions 168 adjacent tothe devices, the space-charge regions are significantly reduced. Sincethe space-charge regions are simply lost area, this geometry allowscloser spacing of the devices and thus permits a more closely-spacedlayout.

In the groups of non-volatile memory cells presently disclosed withrespect to FIGS. 7A and 7B and 8A through 8D, the n-type well regionsare the most heavily doped. The deep n-type well regions 168 are dopedto about 25% of the concentration of the n-type well regions 166. Then-type well regions 42 are doped to a concentration that is about anorder of magnitude lower than that of the n-type well regions 166. Theenhanced p-type well regions are doped to a higher concentration thanthe other p-type well regions to reduce depletion regions.

Referring now to FIG. 8E, a cross-sectional view shows a layout of agroup of non-volatile memory cells according to another aspect of thepresent invention employing deep-trench isolation. As may be easily seenin FIG. 8B, deep-trench isolation regions 172 are disposed around eachof the memory-transistor p-type well 42 and the switch-transistor p-typewells 60 and 80. As will be appreciated by persons of ordinary skill inthe art, and as shown most clearly in FIG. 6B, deep-trench isolationregions 172 extend vertically down into n-type well region 42.Deep-trench isolation regions 172 are formed using known technology.

Referring now to FIGS. 9A and 9B, top and cross-sectional views,respectively, are shown of a layout of a group of non-volatile memorycells according to one aspect of the present invention in which a singlememory transistor controls four switch transistors. The cross section ofFIG. 9B is taken through the dashed line 9B-9B of FIG. 9A.

The memory cell of FIGS. 9A and 9B is similar to the memory cell ofFIGS. 7A and 7B, except that each memory transistor controls four switchtransistors, two in the first p-type switch transistor well 170 to theleft of memory-transistor p-type well 42 and two in the second p-typeswitch transistor well 204 to the right of memory-transistor p-type well42. The layout of the central memory-transistor p-type well 42 is thesame as in the earlier embodiments, wherein n-type active region 44includes a contact 48 for the common sources of upper and lower memorytransistors and contacts 50 and 52 for the drain contacts of the upperand lower memory transistors, respectively. P-type well 180 includesfour n-type active regions 182, 184, 186, and 188. N-type region 182includes a contact 190 for the common sources of upper and lower switchtransistors and contacts 192 and 194, respectively, for the draincontacts of the upper and lower switch transistors. N-type region 184includes a contact 190 for the common sources of upper and lower switchtransistors and contacts 192 and 194, respectively, for the draincontacts of the upper and lower switch transistors. N-type region 186includes a contact 196 for the common sources of upper and lower switchtransistors and contacts 198 and 200, respectively, for the draincontacts of the upper and lower switch transistors. N-type region 188includes a contact 202 for the common sources of upper and lower switchtransistors and contacts 204 and 206, respectively, for the draincontacts of the upper and lower switch transistors.

Similarly, p-type well 210 includes four n-type active regions 212, 214,216 and 218. N-type region 212 includes a contact 220 for the commonsources of upper and lower switch transistors and contacts 222 and 224,respectively, for the drain contacts of the upper and lower switchtransistors. N-type region 214 includes a contact 226 for the commonsources of upper and lower switch transistors and contacts 228 and 230,respectively, for the drain contacts of the upper and lower switchtransistors. N-type region 216 includes a contact 232 for the commonsources of upper and lower switch transistors and contacts 234 and 236,respectively, for the drain contacts of the upper and lower switchtransistors. N-type region 218 includes a contact 238 for the commonsources of upper and lower switch transistors and contacts 240 and 242,respectively, for the drain contacts of the upper and lower switchtransistors.

Floating gate segment 154 (seen in FIG. 9B) is common to the uppermemory transistor formed in active region 44 of the memory-transistorp-type well 42, and the upper switch transistors formed in activeregions 182 and 184 of first switch-transistor p-type well 180, and theupper switch transistors formed in active regions 221 and 214 of secondswitch-transistor p-type well 210. A similar floating gate (out of theplane of the cross section of FIG. 9B) is common to the lower memorytransistors formed in active region 44 of the memory-transistor p-typewell 42, the lower switch transistors formed in active regions 182 and184 of first switch-transistors p-type well 180, and the lower switchtransistors formed in active regions 212 and 214 of secondswitch-transistor p-type well 210. Thus each memory transistor drivesfour switching transistors, two in first p-type switch transistor well180 and two in second p-type switch transistor well 210.

Floating gate segment 156 (seen at the left side of FIG. 9B) is commonto the upper switch transistor formed in active region 186 of firstswitch-transistor p-type well 180, and the upper switch transistorformed in active region 188 of second switch-transistor p-type well 180.A similar floating gate (out of the plane of the cross section of FIG.9B) is common to the lower switch transistors formed in active regions186 and 188 of second switch-transistor p-type well 180. The memorytransistor that drives these switch transistors is past the left edgesof FIGS. 9A and 9B and is not shown.

Similarly, floating gate segment 158 (seen at the right side of FIG. 9B)is common to the upper switch transistor formed in active region 216 ofsecond switch-transistor p-type well 210, and the upper switchtransistor formed in active region 218 of second switch-transistorp-type well 210. A similar floating gate (out of the plane of the crosssection of FIG. 9B) is common to the lower switch transistors formed inactive regions 216 and 218 second switch-transistor p-type well 144. Thememory transistor that drives these switch transistors is past the rightedges of FIGS. 9A and 9B and is not shown.

In all of the embodiments of the present invention shown herein, thememory-transistor p-type wells are decoupled from the switch-transistorp-type wells. This allows optimization of the memory-transistor p-typewells for program and erase efficiency and optimization of theswitch-transistor p-type for device performance. Accordingly, theswitch-transistor p-type may be formed as regular low-voltage or I/Odevice p-type wells. In addition, the switch-transistor source/drainimplants, channel lengths and well implants may be optimized forperformance characteristics such as low output impedance, and tosuppress hot carrier injection programming.

Similarly, the memory-transistor source/drain implants, halo implants,well implants and channel lengths can be optimized for hot carrierinjection or Fowler-Nordheim program and erase efficiency and devicereliability. Depending on the junction breakdown levels, the switchtransistors and the memory transistors can both be placed in low-voltagewells, or the switch transistors can be placed in a low-voltage well andthe memory transistors can be placed in a high-voltage well to optimizethe spacing between the wells to favorably impact memory cell size.

While embodiments and applications of this invention have been shown anddescribed, it would be apparent to those skilled in the art that manymore modifications than mentioned above are possible without departingfrom the inventive concepts herein. The invention, therefore, is not tobe restricted except in the spirit of the appended claims.

1. A non-volatile memory cell including: a semiconductor body; amemory-transistor well disposed within the semiconductor body; aswitch-transistor well disposed within the semiconductor body andelectrically isolated from the memory transistor well; a memorytransistor formed within the memory-transistor well and includingspaced-apart source and drain regions; a switch transistor formed withinthe switch-transistor well and including spaced-apart source and drainregions; a floating gate insulated from and self aligned with the sourceand drain regions of the memory transistor and the switch transistor;and a control gate disposed above and self aligned with respect to thefloating gate and with the source and drain regions of the memorytransistor and the switch transistor.
 2. The non-volatile memory cell ofclaim 1 wherein: the semiconductor body is n-type; the memory-transistorwell and the switch transistor well are both p-type wells; and thememory transistor and the switch transistor are both n-channeltransistors.
 3. The non-volatile memory cell of claim 2 wherein thesemiconductor body is an n-type well disposed in a p-type semiconductorsubstrate.
 4. The non-volatile memory cell of claim 2 wherein: thesemiconductor body is an n-type well formed in a semiconductorsubstrate; and the switch-transistor p-type well is spaced apart fromthe memory-transistor p-type well and is isolated from the memorytransistor p-type well by the n-type well.
 5. The non-volatile memorycell of claim 4, further including at least one additional switchtransistor disposed in a switch-transistor p-type well and sharing afloating gate and a control gate with the memory transistor.
 6. Thenon-volatile memory cell of claim 1 wherein the memory-transistor wellis optimized for memory-transistor characteristics and theswitch-transistor well is optimized for switch-transistorcharacteristics.
 7. The non-volatile memory cell of claim 1 wherein thememory-transistor well and the switch-transistor well are formed todifferent depths.
 8. A non-volatile memory cell including: asemiconductor body; a memory-transistor well disposed within thesemiconductor body; at least one switch-transistor well disposed withinthe semiconductor body and electrically isolated from thememory-transistor well; a memory-transistor formed within thememory-transistor well and including spaced-apart source and drainregions; at least one switch-transistor formed within each of the atleast one switch-transistor well and each including spaced-apart sourceand drain regions; a floating gate insulated from and self aligned withthe source and drain regions of the memory-transistor and each of the atleast one switch-transistor; and a control gate disposed above and selfaligned with respect to the floating gate and with the source and drainregions of the memory-transistor and each of the at least oneswitch-transistor.